Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

Author(s)

• Lee, S. W. Ricky
• American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
• International Mechanical Engineering Congress and Exposition

Bibliographic Information

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]

（EPP, v. 3）

American Society of Mechanical Engineers, c2003

Note

Includes bibliographical references and index

Details

• NCID: BA75359534
• ISBN:
  • 0791837149
• LCCN: 2005297971
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: xi, 893 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Photonics -- Congresses
  • LCSH : Nanotechnology -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Surface mount technology -- Congresses
  • LCSH : Microelectromechanical systems -- Congresses
  • LCSH : Integrated circuits -- Wafer-scale integration -- Congresses
• Parent Bibliography ID:
  • BA6132699X