Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA

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Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA

sponsored by the Electronic and Photonic Packaging Division, ASME

（EPP, v. 5）

American Society of Mechanical Engineers, c2005

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Includes bibliographical references and index

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  • EPP

    American Society of Mechanical Engineers

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