Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

Author(s)

• American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
• International Mechanical Engineering Congress and Exposition

Bibliographic Information

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

sponsored by the Electronic and Photonic Packaging Division, ASME

（EPP, v. 6）

American Society of Mechanical Engineers, c2007

Note

Includes bibliographical references and index

Details

• NCID: BA81949328
• ISBN:
  • 0791847691
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: xix, 526 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Photonics -- Congresses
  • LCSH : Nanotechnology -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Surface mount technology -- Congresses
  • LCSH : Microelectromechanical systems -- Congresses
  • LCSH : Integrated circuits -- Wafer-scale integration -- Congresses
• Parent Bibliography ID:
  • BA6132699X