Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

書誌事項

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

sponsored by the Electronic and Photonic Packaging Division, ASME

(EPP, v. 6)

American Society of Mechanical Engineers, c2007

この図書・雑誌をさがす
注記

Includes bibliographical references and index

関連文献: 1件中  1-1を表示
  • EPP

    American Society of Mechanical Engineers

詳細情報
ページトップへ