Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

著者

• American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
• International Mechanical Engineering Congress and Exposition

書誌事項

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

sponsored by the Electronic and Photonic Packaging Division, ASME

（EPP, v. 6）

American Society of Mechanical Engineers, c2007

注記

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BA81949328
• ISBN:
  • 0791847691
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: xix, 526 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
• 件名:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Photonics -- Congresses
  • LCSH : Nanotechnology -- Congresses
  • LCSH : Microelectronic packaging -- Congresses
  • LCSH : Surface mount technology -- Congresses
  • LCSH : Microelectromechanical systems -- Congresses
  • LCSH : Integrated circuits -- Wafer-scale integration -- Congresses
• 親書誌ID:
  • BA6132699X