Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA
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書誌事項
Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA
(EPP, v. 6)
American Society of Mechanical Engineers, c2007
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注記
Includes bibliographical references and index