Handbook of silicon based MEMS : materials and technologies
著者
書誌事項
Handbook of silicon based MEMS : materials and technologies
（Micro & nano technologies）
William Andrew, 2010
- : hbk
- タイトル別名
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Handbook of silicon based MEMS : materials & technologies
Handbook of silicon based MEMS materials and technologies
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注記
Other editors: Markku Tilli, Ari Lehto, Teruaki Motooka
Includes bibliographical references and index
内容説明・目次
内容説明
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.
Key topics covered include:
Silicon as MEMS material
Material properties and measurement techniques
Analytical methods used in materials characterization
Modeling in MEMS
Measuring MEMS
Micromachining technologies in MEMS
Encapsulation of MEMS components
Emerging process technologies, including ALD and porous silicon
Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.
Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.
目次
- PART I: Silicon as MEMS MaterialEdited by Markku Tilli1. Properties of silicon2. CZ Growth of silicon crystals3. Properties of silicon crystals4. Oxygen in Silicon5. Silicon wafers
- preparation and properties6. Epi wafers
- preparation and properties7. Thick-Film SOI wafers
- preparation and properties8. Silicon dioxidesPART II: Modeling in MEMSEdited by Teruaki Motooka and Risto Nieminen9. Multiscale modeling methods10. Manufacture and processing of MEMS structures11. Mechanical properties of silicon microstructures12. Electrostatic and RF properties of MEMS structures13. Optical Modelling of MEMS 14. Gas Damping in Vibrating MEMS structuresPART III: Measuring MEMS Edited by Veli-Matti Airaksinen15. Introduction to Measuring MEMS16. Silicon wafer and thin film measurements17. Optical measurement of static and dynamic displacement18. MEMS residual stress characterization, methodology and perspective19. Strength of bonded interfaces20. Focused ion and electron beam techniques21.Oxygen and Bulk Microdefects in SiliconPART IV: Micromachining Technologies in MEMS Edited by Helmut Seidel22. MEMS litography23. Deep reactive ion etching (DRIE)24. Wet etching of silicon25. Porous silicon based MEMS26. Atomic layer deposition in MEMS technology27. Metallic glass29. Surface micromachining29. Silicon based bioMEMS micromachining technologiesPART V: Encapsulation of MEMS ComponentsEdited by Heikki Kuisma and Ari Lehto30. Introduction to encapsulation of MEMS devices31. Silicon direct bonding32. Anodic bonding33. Glass frit bonding34. Metallic alloy seal bonding35. Bonding CMOS processed wafers36. Non-Destructive Bond Strength Testing of Anodic Bonded Wafers37. Wafer Bonding Equipment38. Encapsulation by Film Deposition 39. Via Technologies for MEMS40. Outgassing and Gettering41. Dicing of MEMS devices42. Hermecity Tests
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