Handbook of silicon based MEMS materials and technologies
著者
書誌事項
Handbook of silicon based MEMS materials and technologies
（Micro and nano technologies series）
Elsevier, c2020
3rd ed
- pbk.
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注記
Other editors: Mervi Paulasto-Kröckel, Matthias Petzold, Horst Theuss, Teruaki Motooka, Veikko Lindroos
Includes bibliographical references and index
内容説明・目次
内容説明
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures.
The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students.
目次
- Part I 1. Properties of silicon
- Fracture toughness 2. Czochralski Growth of Silicon Crystals 3. Properties of Silicon Crystals 4. Silicon Wafers: Preparation and Properties
- Modern technologies 5. Epi Wafers: Preparation and Properties 6. Thin Films on Silicon 7. Thick-Film SOI Wafers: Preparation and properties Part II 8. Multiscale Modeling Methods 9. Mechanical Properties of Silicon Microstructures 10. Electrostatic and RF-Properties of MEMS Structures 11. Optical Modeling of MEMS 12. Modeling of Silicon Etching 13. Gas Damping in Vibrating MEMS Structures 14. Recent Progress in Large-scale Electronic State Calculations and Data-driven Sciences Part III 15. MEMS Lithography 16. Deep Reactive Ion Etching
- update 17. Wet Etching of Silicon 18. Porous Silicon Based MEMS 19. Surface Micromachining 20. Vapor Phase Etch Processes for Silicon MEMS 21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS 22. Microfluidics and BioMEMS in Silicon Part IV 23. Silicon Direct Bonding 24. Anodic Bonding 25. Glass Frit Bonding 26. Metallic Alloy Seal Bonding 27. Emerging Wafer Bonding Technologies 28. Bonding of CMOS Processed Wafers 29. Wafer-Bonding Equipment 30. Encapsulation by Film Deposition 31. Dicing of MEMS Devices 32. 3D Integration of MEMS 33. Own chapter for eWLP 34. Through-Substrate Via Technologies for MEMS 35. Outgassing and Gettering Part V 36. Silicon Wafer and Thin Film Measurements 37. Oxygen and Bulk Microdefects in Silicon 38. Optical Measurement of Static and Dynamic Displacement in MEMS 39. MEMS Residual Stress Characterization: Methodology and Perspective 40. Microscale deformation analysis 41. Strength of Bonded Interfaces 42. Hermeticity Tests 43. MEMS testing and calibration 44. MEMS Reliability Part VI 45. Case Accelerometer 46. Case Gyroscope 47. Case Pressure Sensor 48. Case Microphone 49. Case Micromirror 50. Case Optical MEMs
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