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Rao R. Tummala, editor.
McGraw-Hill c2001
Available at 2 libraries
co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala
IMAPS , IEEE [1998]
:softbound
Available at 1 libraries
edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Chapman & Hall c1997 2nd ed. Microelectronics packaging handbook Part 2
Available at 4 libraries
Chapman & Hall c1997 2nd ed. Microelectronics packaging handbook Part 3
Available at 3 libraries
Chapman & Hall c1997 2nd ed. Microelectronics packaging handbook Part 1
R.R.Tummala,E.J. Rymaszewski編
日経BP社 1991.3
Available at 15 libraries
edited by Rao R. Tummala, Eugene J. Rymaszewski
Van Nostrand Reinhold c1989
Available at 8 libraries