CiNii Books Author - American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

21

Structural analysis in microelectronic and fiber optic systems : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

American Society of Mechanical Engineers c1995 EEP vol. 12

Available at 1 libraries
22

Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling

American Society of Mechanical Engineers c1995 EEP vol. 13 , AMD vol. 214

Available at 1 libraries
23

Advanced automotive technologies 1995 : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17,1995, San Francisco, California

sponsored by the Dynamic Systems and Control Division, ASME, The Electrical and Electronics Packaging Division, ASME ; edited by Huei Peng, Jeffrey S. Freeman

American Society of Mechanical Engineers c1995 DSC vol. 56 , DE vol. 86

Available at 1 libraries
24

Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama

American Society of Mechanical Engineers c1995 EEP vol. 10.1-10.2

v. 1 , v. 2

Available at 1 libraries
25

Mechanics and materials for electronic packaging : volume 3. coupled field behavior in materials : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.L. Dunn ... [et al.]

American Society of Mechanical Engineers c1994 AMD vol. 193

Available at 1 libraries
26

Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et

American Society of Mechanical Engineers c1994 AMD vol. 195

Available at 1 libraries
27

Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et al.]

American Society of Mechanical Engineers c1994 AMD vol. 187

Available at 1 libraries
28

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by D. Agonafer, R.E. Fulton

American Society of Mechanical Engineers c1994 EEP vol. 9

Available at 2 libraries
29

Structural analysis in microelectronics and fiber optics 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

American Society of Mechanical Engineers c1994 EEP vol. 8

Available at 1 libraries
30

Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

sponsored by the Production Engineering Division and the Electrical and Electronic Packaging Division, ASME ; edited by Y.C. Lee ... [et al.]

American Society of Mechanical Engineers c1993 PED vol. 65 , EEP vol. 5

Available at 1 libraries
31

Structural analysis in microelectronics and fiber optics : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir

American Society of Mechanical Engineers c1993 EEP vol. 7

Available at 1 libraries
32

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. Pecht

American Society of Mechanical Engineers c1993 EEP vol. 6

Available at 2 libraries
33

Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

sponsored by the Electrionic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton

American Society of Mechanical Engineers c1992 EEP vol. 3

Available at 1 libraries
34

Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett

The Society c1992 EEP vol. 2 , PED vol. 60

Available at 1 libraries

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

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