ID:DA08354018
CPMT
Components, Packaging, and Manufacturing Technology Society
Institute of Electrical and Electronic Engineers. Components, Packaging & Manufacturing Technology Society
IEEE Components, Packaging, and Manufacturing Technology Society
IEEE Components, Hybrids, and Manufacturing Technology Society
同姓同名の著者を検索
sponsored by IEEE Microwave Theory and Techniques Society, IEEE Components, Packaging and Manufacturing Technology Society
Institute of Electrical and Electronics Engineers [c1999]
: softbound
所蔵館1館
the International Thermoelectric Society ... [et al.]
IEEE Service Center c1999
:softbound
所蔵館4館
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
:case.
: soft , : case
所蔵館3館
edited by Ronald W. Waynant, John K. Lowell
Institute of Electrical and Electronics Engineers c1999 IEEE Press series on microelectronic systems / Stuart K. Tewksbury, series editor
所蔵館6館
Institute of Electrical and Electronics Engineers 1999-
所蔵館67館
co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala
IMAPS , IEEE [1998]
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
IEEE Service Center [1998]
sponsors, IEEE Components, Packaging, & Manufacturing Technology Society, IEEE Computer Society
Institute of Electrical and Electronics Engineers c1998
Softbound ed. , Microfiche ed.
所蔵館2館
edited by Andrew A.O. Tay, Lim Thian Beng ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ... [et al.]
IEEE c1998
: soft. , : case.
IEEE Service Center c1998
sponsored by the Components, Packaging, and Manufacturing Technology of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Sushil H. Bhavnani, Gray B. Kromann, Douglas J. Nelson
[jointly sponsored by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association]
sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society
IEEE Service Center [1997]
IEEE Service Center c1997
: casebound
general chair, Don Millard
Institute of Electrical and Electronics Engineers , May be purchased from IEEE Service Center c1997
: softbound , : casebound
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Laurence LaForge...[et al.]
: case
sponsored by IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, SHM, the Microelectronics Society-Japan
sponsored jointly by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
sponsored by IEEE Microwave Theory and Techniques Society and IEEE Components, Packaging and Manufacturing Technology Society
Institute of Electrical and Electronics Engineers [1996]