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関連文献: 29件中 21-29を表示
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- Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
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sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen
American Society of Mechanical Engineers c1993 EEP vol. 4-2
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- Structural analysis, materials and processes, design, reliability : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
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sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen
American Society of Mechanical Engineers c1993 EEP vol. 4-1
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23
- Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
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sponsored by the Production Engineering Division and the Electrical and Electronic Packaging Division, ASME ; edited by Y.C. Lee ... [et al.]
American Society of Mechanical Engineers c1993 PED vol. 65 , EEP vol. 5
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24
- Structural analysis in microelectronics and fiber optics : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir
American Society of Mechanical Engineers c1993 EEP vol. 7
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25
- Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
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sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. Pecht
American Society of Mechanical Engineers c1993 EEP vol. 6
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- Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
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sponsored by the Electrionic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton
American Society of Mechanical Engineers c1992 EEP vol. 3
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- Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
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sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett
The Society c1992 EEP vol. 2 , PED vol. 60
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- Advances in electronic packaging, 1992 : proceedings of the Joint ASME/JSME Conference on Electronic Packaging : presented at the First Joint ASME/JSME Conference on Electronic Packaging, Milpitas, California, April 9-12, 1992
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sponsored by the American Society of Mechanical Engineers, the Japan Society of Mechanical Engineers ; edited by William T. Chen, Hiroyuki Abe'
American Society of Mechanical Engineers c1992 EEP vol. 1. 1-2
v. 1 , v. 2
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- Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991
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sponsored by the Applied Mechanics Division, ASME, the Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman
ASME c1991 AMD v. 131 , EEP v. 1
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