Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

著者

• International Intersociety Electronic Packaging Conference
• Hsu, Tai-Ran
• Bar-Cohen, Avram
• 中山, 恒 ナカヤマ, ワタル
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• 日本機械学会 ニホン キカイ ガッカイ

書誌事項

Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama

（EEP, vol. 10.1-10.2）

American Society of Mechanical Engineers, c1995

• v. 1
• v. 2

• NII書誌ID(NCID): BA25588518
• ISBN:
  • 0791813037
  • 0791813037
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: 2 v.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
• 親書誌ID:
  • BA14250087