Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

Author(s)

• International Intersociety Electronic Packaging Conference
• Hsu, Tai-Ran
• Bar-Cohen, Avram
• 中山, 恒 ナカヤマ, ワタル
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• 日本機械学会 ニホン キカイ ガッカイ

Bibliographic Information

Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama

（EEP, vol. 10.1-10.2）

American Society of Mechanical Engineers, c1995

• v. 1
• v. 2

Details

• NCID: BA25588518
• ISBN:
  • 0791813037
  • 0791813037
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: 2 v.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC20 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Congresses
• Parent Bibliography ID:
  • BA14250087