Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Author(s)

• Chen, William T.
• Read, D. T.
• American Society of Mechanical Engineers. Applied Mechanics Division
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition
• Symposium on Application of Fracture Mechanics in Electronic Packaging

Bibliographic Information

Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read

（AMD, vol. 222）（EEP, vol. 20）

American Society of Mechanical Engineers, c1997

Other Title

Fracture mechanics in electronic packaging

Note

"Papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii

Includes bibliographical references and index

Details

• NCID: BA44033918
• ISBN:
  • 0791818276
• LCCN: 97076706
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York, N.Y.
• Pages/Volumes: vi, 193 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic packaging -- Materials -- Fracture -- Congresses
  • LCSH : Multichip modules (Microelectronics) -- Materials -- Fracture -- Congresses
  • LCSH : Fracture mechanics -- Congresses
• Parent Bibliography ID:
  • BA00053361
  • BA14250087