Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

著者

• Chen, William T.
• Read, D. T.
• American Society of Mechanical Engineers. Applied Mechanics Division
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• International Mechanical Engineering Congress and Exposition
• Symposium on Application of Fracture Mechanics in Electronic Packaging

書誌事項

Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read

（AMD, vol. 222）（EEP, vol. 20）

American Society of Mechanical Engineers, c1997

タイトル別名

Fracture mechanics in electronic packaging

注記

"Papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii

Includes bibliographical references and index

内容説明・目次

内容説明

Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA44033918
• ISBN:
  • 0791818276
• LCCN: 97076706
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: vi, 193 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Materials -- Fracture -- Congresses
  • LCSH : Multichip modules (Microelectronics) -- Materials -- Fracture -- Congresses
  • LCSH : Fracture mechanics -- Congresses
• 親書誌ID:
  • BA00053361
  • BA14250087