Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

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Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]

（EEP, v. 11）（MD, v. 64）

American Society of Mechanical Engineers, c1995

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注記

Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition

Includes bibliographical references and index

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内容説明

Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal

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  • EEP

    ASME

  • MD

    American Society of Mechanical Engineers

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