Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

著者

• Wu, Tien Y.
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Materials Division

書誌事項

Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]

（EEP, v. 11）（MD, v. 64）

American Society of Mechanical Engineers, c1995

注記

Papers presented at a symposium held during the 1995 ASME International Mechancial Engineering Congress and Exposition

Includes bibliographical references and index

詳細情報

• NII書誌ID(NCID): BA44130608
• ISBN:
  • 0791817369
• LCCN: 95081270
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: vi, 271 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Fracture mechanics -- Congresses
• 親書誌ID:
  • BA14250087
  • BA07638589