Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

著者

• Agonafer, D.
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

書誌事項

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

（EEP, vol. 18）

American Society of Mechanical Engineers, c1996

注記

Includes bibliographical references and index

内容説明・目次

内容説明

Proceedings of the November 1996 symposium sponsored by the Computer Aided Design for Electronic Packaging Committee of the Electrical and Electronic Packaging Division. Contains 15 papers, including several related to the use of computer simulations to solve complex packaging problems related to th

「Nielsen BookData」 より

詳細情報

• NII書誌ID(NCID): BA44130798
• ISBN:
  • 0791815536
• LCCN: 96079040
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York, N.Y.
• ページ数/冊数: v, 123 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.25
• 件名:
  • LCSH : Electronic packaging -- Cooling -- Congresses
  • LCSH : Heat sinks (Electronics) -- Congresses
  • LCSH : CAD/CAM systems -- Congresses
  • LCSH : Computer-aided engineering -- Congresses
  • LCSH : Computer-aided design -- Congresses
• 親書誌ID:
  • BA14250087