CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

書誌事項

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

(EEP, vol. 23)(HTD, vol. 356)

American Society of Mechanical Engineers, c1997

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注記

Includes bibliographical references and index

関連文献: 2件中  1-2を表示

  • EEP

    ASME

  • HTD

    American Society of Mechanical Engineers

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