CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Author(s)

• Agonafer, D.
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Bibliographic Information

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

（EEP, vol. 23）（HTD, vol. 356）

American Society of Mechanical Engineers, c1997

Note

Includes bibliographical references and index

Details

• NCID: BA44133264
• ISBN:
  • 0791818527
• LCCN: 98166447
• Country Code: us
• Title Language Code: eng
• Text Language Code: eng
• Place of Publication: New York
• Pages/Volumes: v, 109 p.
• Size: 28 cm
• Classification:
  • LCC : TK7870.25
  • DC21 : 621.381/046
• Subject Headings:
  • LCSH : Electronic apparatus and appliances -- Temperature control -- Congresses
  • LCSH : Electronic packaging -- Design -- Data processing -- Congresses
  • LCSH : Heat -- Transmission -- Data processing -- Congresses
  • LCSH : Heat sinks (Electronics) -- Congresses
  • LCSH : Computer-aided engineering -- Congresses
• Parent Bibliography ID:
  • BA14250087
  • BA00053441