Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

著者

• Suhling, J. C. (Jeffrey C.)
• Liechti, K. M.
• Liu, S. (Sheng)
• International Mechanical Engineering Congress and Exposition
• American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
• American Society of Mechanical Engineers. Applied Mechanics Division

書誌事項

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu

（EEP, vol. 22）（AMD, vol. 226）

American Society of Mechanical Engineers, c1997

注記

Includes bibliographical references and author index

詳細情報

• NII書誌ID(NCID): BA4413348X
• ISBN:
  • 0791818500
• LCCN: 97077357
• 出版国コード: us
• タイトル言語コード: eng
• 本文言語コード: eng
• 出版地: New York
• ページ数/冊数: vi, 136 p.
• 大きさ: 28 cm
• 分類:
  • LCC : TK7870.15
  • DC21 : 621.381/046
• 件名:
  • LCSH : Electronic packaging -- Congresses
  • LCSH : Mechanics, Applied -- Congresses
• 親書誌ID:
  • BA14250087
  • BA00053361