Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
著者
書誌事項
Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
(EEP, vol. 22)(AMD, vol. 226)
American Society of Mechanical Engineers, c1997
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注記
Includes bibliographical references and author index
内容説明・目次
内容説明
Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.
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