Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

著者

書誌事項

Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu

（EEP, vol. 22）（AMD, vol. 226）

American Society of Mechanical Engineers, c1997

大学図書館所蔵 件 / 全2件

この図書・雑誌をさがす

注記

Includes bibliographical references and author index

内容説明・目次

内容説明

Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.

「Nielsen BookData」 より

関連文献： 2件中  1-2を表示

  • EEP

    ASME

  • AMD

    American Society of Mechanical Engineers

詳細情報

ページトップへ