Agonafer, D.

ID:DA06967093

Alias Name: Agonafer, Dereje

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1

Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee

American Society of Mechanical Engineers c1999 EEP vol. 26

:set , 1 , 2

Available at 2 libraries
2

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

American Society of Mechanical Engineers c1997 EEP vol. 23 , HTD vol. 356

Available at 1 libraries
3

Application of CAE/CAD to electronic systems : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]

American Society of Mechanical Engineers c1996 EEP vol. 18

Available at 1 libraries
4

CAE/CAD application to electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by D. Agonafer, R.E. Fulton

American Society of Mechanical Engineers c1994 EEP vol. 9

Available at 2 libraries
5

Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

sponsored by the Heat Transfer Division, ASME ; edited by D. Agonafer

American Society of Mechanical Engineers c1993 HTD vol. 255

Available at 1 libraries
6

Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

sponsored by the Electrionic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. Fulton

American Society of Mechanical Engineers c1992 EEP vol. 3

Available at 1 libraries
7

Heat transfer in electronic equipment, 1991

presented at the 28th National Heat transfer Conference, Minneapolis, Minnesota, July 28-31, 1991 ; sponsored by the Heat Transfer Division, ASME ; edited by A. Ortega, D. Agonafer, B.W. Webb

American Society of Mechanical Engineers c1991 HTD vol. 171

Available at 3 libraries
8

Numerical simulation of convection in electronic equipment cooling : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989

sponsored by the Heat Transfer Division, ASME ; edited by A. Ortega, D. Agonafer

American Society of Mechanical Engineers c1989 HTD vol. 121

Available at 3 libraries

Agonafer, D.

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