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書誌事項
Electronic packaging and interconnection series
McGraw-Hill
この図書・雑誌をさがす
関連文献： 15件中 1-15を表示
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1
- Electronic packaging and interconnection handbook
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Charles A. Harper, editor in chief
McGraw-Hill c2005 4th ed McGraw-Hill handbooks , Electronic packaging and interconnection series
所蔵館1館
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2
- Electronic assembly fabrication : chips, circuit boards, packages, and components
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Charles A. Harper, editor-in-chief
McGraw-Hill c2002 McGraw-Hill professional engineering , Electronic packaging and interconnection series
所蔵館1館
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3
- Electronic packaging and interconnection handbook
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Charles A. Harper, editor-in-chief
McGraw-Hill c2000 3rd ed McGraw-Hill handbooks , Electronic packaging and interconnection series
所蔵館3館
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4
- Chip scale package (CSP) : design, materials, processes, reliability, and applications
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John H. Lau, Shi-Wei Ricky Lee
McGraw-Hill c1999 Electronic packaging and interconnection series
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5
- Inside SPICE
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Ron M. Kielkowski
McGraw-Hill c1998 2nd ed. Electronic packaging and interconnection series
所蔵館6館
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6
- Electronic connector handbook : theory and applications
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Robert S. Mroczkowski
McGraw-Hill c1998 Electronic packaging and interconnection series
所蔵館1館
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7
- Thin film technology handbook
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Aicha A.R. Elshabini-Riad, Fred D. Barlow III
McGraw-Hill c1998 Electronic packaging and interconnection series
: hardcover
所蔵館13館
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8
- Printed circuit board materials handbook
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Martin W. Jawitz, editor in chief
McGraw-Hill 1997 Electronic packaging and interconnection series
:acid-free paper
所蔵館1館
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9
- Wire bonding in microelectronics : materials, processes, reliability, and yield
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George G. Harmon
McGraw-Hill c1997 2nd ed Electronic packaging and interconnection series
所蔵館1館
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10
- Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
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John H. Lau, Yi-Hsin Pao
McGraw-Hill c1997 Electronic packaging and interconnection series
: hc
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11
- Hybrid microelectronics handbook
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[edited by] Jerry E. Sergent, Charles A. Harper
McGraw-Hill c1995 2nd ed Electronic packaging and interconnection series
所蔵館2館
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12
- Plastics for electronics : materials, properties, and design applications
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William M. Alvino
McGraw-Hill c1995 Electronic packaging and interconnection series
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13
- Ball grid array technology
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John H. Lau, editor
McGraw-Hill c1995 Electronic packaging and interconnection series
: acid-free paper
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14
- Electronic materials and processes handbook
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Charles A. Harper, Ronald N. Sampson, [editors]
McGraw-Hill c1994 2nd ed Electronic packaging and interconnection series
所蔵館6館
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15
- Electronic packaging, microelectronics, and interconnection dictionary
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Charles A. Harper, Martin B. Miller
McGraw-Hill c1993 Electronic packaging and interconnection series
所蔵館4館
